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MPI’s Roadmap Update on Vertical Probe Card Technologies
As aps are representing MPI Corporation’s advanced vertical Probe Card Technologies in Europe and Israel, we like to give an update on the latest technologies for probing on Pads, Solder-Bumps or Pillars:
Cobra Technology with minimum achievable pitches down to 80 µm the Cobra Technology is designed with buckling technology and can achieve high pin-count (~30k/card) and large array layout probing. With MPI’s design as a semi-fixed film structure, easy probe replacements are possible to support customer’s probe card uptime requirements. Typical applications are probing on Solder-Bumps or on Cap-Pillars with FLAT tip shaped probes and probing on Al Pads or Cu-Pillars (without cap) with POINTed tip shaped probes.

MPI Corporation develops and produces patented Space Transformer Technologies for multi-site and thin package substrate applications.  The products are perfectly suited for high speed loop-back and KGD (Known Good Die) testing based on custom designed requirements. These technologies are offering very attractive cost of ownership and shortest lead-times compared with conventional substrate Space Transformer Technologies.



  • Different materials available
  • Different beam diameters available
  • Pointed or flat shape – depending on probing task
  • High CCC (at 10% force drop) values achievable; up to 1.6 A
  • Up to 30,000 pins per probe head
  • Low gram force per pin

    Durable and repairable designed probe heads
Further Info on Cobra

MEMS 3DS Technology
with pitch sizes down to 80 µm, the 3DS is a 3-dimensional spiral probe structure manufactured with a proprietary MEMS process. it’s suitable for high pin count (30k/card), high current applications and it supports high over-travel (force) testing tasks. With a “preloading” possibility and a rotatable tip, the 3DS Technology supports low and stable contact resistance either on Cu-Pillar or Al probing. The impact to the pad during probing with 3DS Technology are smaller scrub marks at fine-pitch pad probing. 3DS Technology offers easy probe head maintenance and single probe replacements.

MPI Corporation develops and produces patented Space Transformer Technologies for multi-site and thin package substrate applications.  The products are perfectly suited for high speed loop-back and KGD (Known Good Die) testing based on custom designed requirements. These technologies are offering very attractive cost of ownership and shortest lead-times compared with conventional substrate Space Transformer Technologies.



  • Pointed or flat tips available – depending on probing task
  • “Drilling Contact” designable
  • Up to 30,000 pins per probe head
  • In-house manufacturing of MEMS contact elements
Further Info on MEMS 3DS

MEMS Gt Technology

  • Pitch sizes down to 40µm (peripheral layout) under evaluation
  • Pointed and flat tips available – depending on probing task
  • Very low gram force per pin
  • High CCC values achievable – 1.1 A
  • Currently Up to 10,000 MEMS pins per probe head achievable
  • In-house manufacturing of MEMS contact elements
Further Info on Gt

For all technologies „hand-wired“ or MLC/MLO types of Space Transformers available.





Repair Service for advanced vertical Probe Card Technologies are available at our aps Repair & Service Center in Dresden (RCDD), Germany.
Further Info on VPC Repair

For further details and to discuss of your individual solution, please visit our newly designed website
at www.aps-munich.com.  


We would be pleased to hear from you either via our contact forms on the webpage or email at contact@aps-munich.com.

Of course you can also give us a call at +49 89841027-0



aps Solutions GmbH
Gutenbergstrasse 1
82178 Puchheim / Munich
Germany
Phone +49 (0)89 841027-0
Fax   +49 (0)89 841027-11
Email : contact@aps-munich.com
www.aps-munich.com
Repair and Service Center Dresden:
Hugo-Junkers-Ring 9,
D-01109 Dresden
Germany





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aps solutions GmbH
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82178 Puchheim
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