MEMS 3DS Technology: With pitch sizes down to 80µm, the 3DS is a 3-dimensional spiral probe structure manufactured with a proprietary MEMS process. It’s suitable for high pin count (30k/card), high current applications and it supports high over-travel (force) testing tasks. With a “preloading” possibility and a rotatable tip, the 3DS Technology supports low and stable contact resistance either on Cu-Pillar or Al probing. The impact to the pad during probing with 3DS Technology are smaller scrub marks at fine-pitch pad probing. 3DS Technology offers easy probe head maintenance and single probe replacements.
MPI Corporation develops and produces patented Space Transformer Technologies for multi-site and thin package substrate applications. The products are perfectly suited for high speed loop-back and KGD (Known Good Die) testing based on custom designed requirements. These technologies are offering very attractive cost of ownership and shortest lead-times compared with conventional substrate Space Transformer Technologies.